US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Semiconductor module and manufacturing method therefor" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,799, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module and manufacturing method therefor" was invented by Tatsuya Karasawa (Shiojiri-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes electrically connecting first and second semiconductor elements to conductive plates, respectively, on the front surface of one or more insulating substrates disposed on a metal base; disposing, on the base, a case including a chassis, a first lead frame having a first wiring part extending in a wired direction parallel to the front surface, and a second lead frame having a second wiring part in t...