ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,796, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Package-on-package (POP) type semiconductor packages" was invented by Minho Lee (Cheonan-si, South Korea) and Jaewook Yoo (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a secon...