ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,789, issued on Nov. 3, was assigned to KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (Seoul, South Korea). "Security code including metamaterial... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,790, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having an antenna patter... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,791, issued on Nov. 3, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming selective shielding ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,792, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Transmission line structure with ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,793, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Resistance temperature detector at hybrid bond... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,794, issued on Nov. 3, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Front-end module with vertically stacked die and circulator" was i... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,795, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Modular package structures with interposers ha... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,796, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Package-on-package (POP) type semiconductor pa... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,797, issued on Nov. 3, was assigned to MOSAIC MICROSYSTEMS LLC (Rochester, N.Y.). "Facilitating formation of a via in a substrate" was inven... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,798, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package" w... और पढ़ें