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US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor devices and data storage systems including the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,738, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor devices and data storage syst... Read More


US Patent Issued to International Business Machines on Nov. 3 for "Super via within backside level" (New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,739, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Super via within backside level" was invented ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Integrated circuit device including a power rail" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,740, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device including a power ra... Read More


US Patent Issued to GLOBALFOUNDRIES U.S. on Nov. 3 for "Structure with cavity around through semiconductor via" (New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,741, issued on Nov. 3, was assigned to GLOBALFOUNDRIES U.S. INC. (Malta, N.Y.). "Structure with cavity around through semiconductor via" was... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Integrated circuit devices including stacked transistors and methods of forming the same" (New York, Virginia Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,742, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea). "Integrated circuit devices including stacked transistors... Read More


US Patent Issued to Intel on Nov. 3 for "Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding members" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,743, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods, systems, apparatus, and articles of manufacture to produ... Read More


US Patent Issued to Intel on Nov. 3 for "Integrated circuit interconnect structures including copper-free vias" (Oregon Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,744, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit interconnect structures including copper-free ... Read More


US Patent Issued to CISCO TECHNOLOGY on Nov. 3 for "Via ground structures" (Chinese, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,745, issued on Nov. 3, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via ground structures" was invented by Wenbin Ma (Shanghai... Read More


US Patent Issued to SOCIONEXT on Nov. 3 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,746, issued on Nov. 3, was assigned to SOCIONEXT INC. (Kanagawa, Japan). "Semiconductor device" was invented by Wenzhen Wang (Yokohama, Japa... Read More


US Patent Issued to Intel on Nov. 3 for "Inline circuit edit" (Oregon, California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,747, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Inline circuit edit" was invented by Clifford J. Engel (Hillsboro... Read More