US Patent Issued to Intel on Nov. 3 for "Integrated circuit interconnect structures including copper-free vias" (Oregon Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,744, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit interconnect structures including copper-free vias" was invented by Daniel B. OBrien (Beaverton, Ore.), Jeffrey S. Leib (Beaverton, Ore.), James Y. Jeong (Beaverton, Ore.), Chia-Hong Jan (Portland, Ore.), Peng Bai (Hillsboro, Ore.), Seungdo An (Portland, Ore.), Pavel S. Plekhanov (Portland, Ore.) and Debashish Basu (Beaverton, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit interconnect structure compatible with single damascene techniques and that includes a non-copper via comprising metal(s) of low resistivity that can be deposited a...