US Patent Issued to International Business Machines on Nov. 3 for "Super via within backside level" (New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,739, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Super via within backside level" was invented by Tsung-Sheng Kang (Ballston Lake, N.Y.), Tao Li (Slingerlands, N.Y.), Ruilong Xie (Niskayuna, N.Y.) and Daniel Charles Edelstein (White Plains, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor IC device includes a super via. The super via includes a lower skip via and an upper skip via. A connecting wire may be directly between or may separate the lower skip via and the upper skip via. The upper skip via may be adequately electrically isolated from a surrounding wire by an upper liner. The lo...