ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,773, issued on Oct. 20, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method and substrate processing appa... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,774, issued on Oct. 20, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, inner tube and method of manufactu... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,775, issued on Oct. 20, was assigned to ACM RESEARCH (SHANGHAI) INC. (Shanghai). "Drying apparatus and method based on supercritical fluid"... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,776, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Drying system with integrated substrate alignment st... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,777, issued on Oct. 20, was assigned to Mitsubishi Electric Corp. (Tokyo). "Method for manufacturing semiconductor apparatus and semiconduc... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,778, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Substrate bonding apparatus and method of... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,779, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Photo-emitting plasma for activation in processing c... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,780, issued on Oct. 20, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Processing apparatus, recording medium, substrate processing metho... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,781, issued on Oct. 20, was assigned to Lam Research Corp. (Fremont, Calif.). "Apparatuses for measuring gap between a substrate support pl... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,782, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Substrate processing apparatus and substrate... Read More