US Patent Issued to KOKUSAI ELECTRIC on Oct. 20 for "Processing apparatus, recording medium, substrate processing method, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,780, issued on Oct. 20, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Processing apparatus, recording medium, substrate processing method, and method of manufacturing semiconductor device" was invented by Masako Sueyoshi (Toyama, Japan), Makoto Nomura (Toyama, Japan) and Taku Hisada (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: a storage storing at least a temperature control table where a set value of a heater heating a substrate and a set value of a lamp heating the substrate are set for a target temperature of the substrate, and a process recipe constituted by steps of processing the...