US Patent Issued to Sandisk Technologies on Nov. 3 for "Three-dimensional memory device including inclined word line contact strips and methods of forming the same" (Japanese Inventors)

Posted On: 2026-11-03

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,282, issued on Nov. 3, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device including inclined wor... Read More

US Patent Issued to Kioxia on Nov. 3 for "Semiconductor memory device and manufacturing method of semiconductor memory device" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,283, issued on Nov. 3, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device and manufacturing method of semiconductor memory d... Read More

US Patent Issued to SK hynix on Nov. 3 for "Semiconductor device and manufacturing method of semiconductor device" (South Korean Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,284, issued on Nov. 3, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and manufacturing method of semicondu... Read More

US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Nov. 3 for "Interconnect structures of three-dimensional memory devices" (Chinese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,285, issued on Nov. 3, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Interconnect structures of three-dimensional me... Read More

US Patent Issued to Micron Technology on Nov. 3 for "Integrated assemblies and methods of forming integrated assemblies" (Idaho Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,286, issued on Nov. 3, was assigned to Micron Technology Inc. (Boise, Idaho). "Integrated assemblies and methods of forming integrated assem... Read More

US Patent Issued to MACRONIX INTERNATIONAL on Nov. 3 for "Memory device and manufacturing method thereof" (Taiwanese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,287, issued on Nov. 3, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan). "Memory device and manufacturing method thereof" w... Read More

US Patent Issued to Micron Technology on Nov. 3 for "Memory circuitry and methods used in forming memory circuitry" (Idaho Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,288, issued on Nov. 3, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory circuitry and methods used in forming memory circuitry... Read More

US Patent Issued to Kioxia on Nov. 3 for "Semiconductor memory device and semiconductor device" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,289, issued on Nov. 3, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device and semiconductor device" was invented by Yoshikaz... Read More

US Patent Issued to Sandisk Technologies on Nov. 3 for "Three-dimensional memory device including dielectric wall compartments for word line contact via structures and methods of forming the same" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,290, issued on Nov. 3, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device including dielectric w... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor devices" (South Korean Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,291, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices" was invented by Kang Li... Read More

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US Patent Issued to Sandisk Technologies on Nov. 3 for "Three-dimensional memory device including inclined word line contact strips and methods of forming the same" (Japanese Inventors)

US Patent Issued to Kioxia on Nov. 3 for "Semiconductor memory device and manufacturing method of semiconductor memory device" (Japanese Inventors)

US Patent Issued to SK hynix on Nov. 3 for "Semiconductor device and manufacturing method of semiconductor device" (South Korean Inventor)

US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Nov. 3 for "Interconnect structures of three-dimensional memory devices" (Chinese Inventors)

US Patent Issued to Micron Technology on Nov. 3 for "Integrated assemblies and methods of forming integrated assemblies" (Idaho Inventors)

US Patent Issued to MACRONIX INTERNATIONAL on Nov. 3 for "Memory device and manufacturing method thereof" (Taiwanese Inventor)

US Patent Issued to Micron Technology on Nov. 3 for "Memory circuitry and methods used in forming memory circuitry" (Idaho Inventors)

US Patent Issued to Kioxia on Nov. 3 for "Semiconductor memory device and semiconductor device" (Japanese Inventors)

US Patent Issued to Sandisk Technologies on Nov. 3 for "Three-dimensional memory device including dielectric wall compartments for word line contact via structures and methods of forming the same" (Japanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor devices" (South Korean Inventors)