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US Patent Issued to NITTO DENKO on Nov. 3 for "Wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,163, issued on Nov. 3, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board" was invented by Shusaku Shibata (Osaka, Japa... Read More


US Patent Issued to Advanced ACEBIOTEK on Nov. 3 for "Printed circuit board structure and printed circuit board detection method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,164, issued on Nov. 3, was assigned to Advanced ACEBIOTEK Co. LTD. (Hsinchu County, Taiwan). "Printed circuit board structure and printed ci... Read More


US Patent Issued to GUANGZHOU FANGBANG ELECTRONICS on Nov. 3 for "Metal foil, circuit board, and method for manufacturing circuit board" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,165, issued on Nov. 3, was assigned to GUANGZHOU FANGBANG ELECTRONICS Co. LTD (Guangzhou, China). "Metal foil, circuit board, and method for... Read More


US Patent Issued to AMS-OSRAM INTERNATIONAL on Nov. 3 for "Optoelectronic assembly and method for the production of same" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,166, issued on Nov. 3, was assigned to AMS-OSRAM INTERNATIONAL GMBH (Regensburg, Germany). "Optoelectronic assembly and method for the produ... Read More


US Patent Issued to Dell Products on Nov. 3 for "BGA antipad design for reduced cross talk" (Indian, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,167, issued on Nov. 3, was assigned to Dell Products LP (Round Rock, Texas). "BGA antipad design for reduced cross talk" was invented by Mal... Read More


US Patent Issued to InnoLux on Nov. 3 for "Electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,168, issued on Nov. 3, was assigned to InnoLux Corp. (Miao-Li County, Taiwan). "Electronic device" was invented by Yuan-Lin Wu (Miao-Li Coun... Read More


US Patent Issued to IBIDEN on Nov. 3 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,169, issued on Nov. 3, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Japan),... Read More


US Patent Issued to Lenovo Global Technology (United States) on Nov. 3 for "Position detection using a capacitive sensor" (North Carolina Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,170, issued on Nov. 3, was assigned to Lenovo Global Technology (United States) Inc. (Morrisville, N.C.). "Position detection using a capaci... Read More


US Patent Issued to Toyoda Gosei on Nov. 3 for "Semiconductor device and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,355, issued on Nov. 3, was assigned to Toyoda Gosei Co. Ltd. (Kiyosu-shi, Japan). "Semiconductor device and method for producing semiconduct... Read More


US Patent Issued to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY on Nov. 3 for "Thin-film transistor having a source/drain region beneath a gate and a source electrode on a different layer from a drain electrode, display panel comprising the same, and manufacturing method of the display panel" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,357, issued on Nov. 3, was assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Shenzhen, China). "Thin-film transistor having a ... Read More