ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,167, issued on Nov. 3, was assigned to Dell Products LP (Round Rock, Texas).
"BGA antipad design for reduced cross talk" was invented by Mallikarjun Vasa (Secunderabad, India), Vijender Kumar (Bangalore, India), Naga Hara Sathya Sree Tammisetti (Hyderabad, India) and Bhyrav Mutnury (Round Rock, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A PCB includes a top metal layer having BGA pads, a first internal metal layer having a first breakout trace coupled to a first BGA pad by a first via, a second internal metal layer having a second breakout trace coupled to a second BGA pad by a second via, and a third internal metal having a third breakout ...