ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,163, issued on Nov. 3, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Wiring circuit board" was invented by Shusaku Shibata (Osaka, Japan), Takaya Kouchi (Osaka, Japan) and Teppei Niino (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a base insulating layer, a conductive layer, and a cover insulating layer. The conductive layer has a terminal and a wiring. The wiring has a body portion and a connecting portion. The connecting portion connects the body portion to the terminal. The cover insulating layer has a cover body portion and a protruding portion. The cover body portion covers the body portion. Th...