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US Patent Issued to IBIDEN on Oct. 20 for "Method for manufacturing wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,384, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Method for manufacturing wiring substrate" was invented by Yasushi... और पढ़ें


US Patent Issued to Unimicron Technology on Oct. 20 for "Circuit board structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,385, issued on Oct. 20, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan). "Circuit board structure and manufacturing metho... और पढ़ें


US Patent Issued to LG ENERGY SOLUTION on Oct. 20 for "Circuit board assembly manufacturing method, circuit board assembly manufactured by same, and electric vehicle including same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,386, issued on Oct. 20, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Circuit board assembly manufacturing method, circuit... और पढ़ें


US Patent Issued to FUJI on Oct. 20 for "Liquid transfer device for forming liquid film on a surface of a transfer table" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,387, issued on Oct. 20, was assigned to FUJI Corp. (Chiryu, Japan). "Liquid transfer device for forming liquid film on a surface of a trans... और पढ़ें


US Patent Issued to Phoenix Pioneer Technology on Oct. 20 for "Package carrier core layer structure integrated with magnetic element structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,388, issued on Oct. 20, was assigned to Phoenix Pioneer Technology Co. Ltd. (Hsinchu County, Taiwan). "Package carrier core layer structure... और पढ़ें


US Patent Issued to DAIWA on Oct. 20 for "Method for manufacturing wiring board or wiring board material" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,389, issued on Oct. 20, was assigned to DAIWA Co. LTD. (Nagano, Japan). "Method for manufacturing wiring board or wiring board material" wa... और पढ़ें


US Patent Issued to AT&S Austria Technologie & Systemtechnik on Oct. 20 for "Component carrier with magnetic element, magnetic inlay, and manufacturing method" (Austrian Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,390, issued on Oct. 20, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Component carrier with magnetic ele... और पढ़ें


US Patent Issued to Delta Electronics (Shanghai) on Oct. 20 for "Insulation structure and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,391, issued on Oct. 20, was assigned to Delta Electronics (Shanghai) Co. Ltd. (Shanghai). "Insulation structure and electronic device" was ... और पढ़ें


US Patent Issued to TELEFONAKTIEBOLAGET LM ERICSSON on Oct. 20 for "Method and apparatus for temperature and humidity control in an electrical enclosure" (Swedish Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,392, issued on Oct. 20, was assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (Stockholm). "Method and apparatus for temperature and humid... और पढ़ें


US Patent Issued to EYE-FI HOLDINGS on Oct. 20 for "Flexible light-emitting diode board with edge structure for making concave and convex corners in a multi-board display" (California, Georgia Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,393, issued on Oct. 20, was assigned to EYE-FI HOLDINGS LLC (Las Vegas). "Flexible light-emitting diode board with edge structure for makin... और पढ़ें