ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,384, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Method for manufacturing wiring substrate" was invented by Yasushi... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,385, issued on Oct. 20, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan). "Circuit board structure and manufacturing metho... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,386, issued on Oct. 20, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Circuit board assembly manufacturing method, circuit... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,387, issued on Oct. 20, was assigned to FUJI Corp. (Chiryu, Japan). "Liquid transfer device for forming liquid film on a surface of a trans... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,388, issued on Oct. 20, was assigned to Phoenix Pioneer Technology Co. Ltd. (Hsinchu County, Taiwan). "Package carrier core layer structure... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,389, issued on Oct. 20, was assigned to DAIWA Co. LTD. (Nagano, Japan). "Method for manufacturing wiring board or wiring board material" wa... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,390, issued on Oct. 20, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Component carrier with magnetic ele... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,391, issued on Oct. 20, was assigned to Delta Electronics (Shanghai) Co. Ltd. (Shanghai). "Insulation structure and electronic device" was ... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,392, issued on Oct. 20, was assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (Stockholm). "Method and apparatus for temperature and humid... और पढ़ें
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,393, issued on Oct. 20, was assigned to EYE-FI HOLDINGS LLC (Las Vegas). "Flexible light-emitting diode board with edge structure for makin... और पढ़ें