ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,385, issued on Oct. 20, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan).
"Circuit board structure and manufacturing method thereof" was invented by Chin-Sheng Wang (Taoyuan City, Taiwan), Ra-Min Tain (Hsinchu County, Taiwan), Chih-Kai Chan (Taoyuan City, Taiwan) and Shih-Lian Cheng (New Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure includes a core layer, at least one electroplating metal layer, at least one dielectric layer and at least one conductive metal layer. The core layer includes at least one dielectric portion and at least one metal portion. The electroplating metal layer is d...