US Patent Issued to LG ENERGY SOLUTION on Oct. 20 for "Circuit board assembly manufacturing method, circuit board assembly manufactured by same, and electric vehicle including same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,386, issued on Oct. 20, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea).

"Circuit board assembly manufacturing method, circuit board assembly manufactured by same, and electric vehicle including same" was invented by Bum Jick Lee (Daejeon, South Korea) and Young Su Son (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a method for manufacturing a circuit board assembly, which includes: mounting a plurality of components on a circuit board; preparing a mold comprising a concave portion corresponding to a shape of each of the plurality of components and a convex portion corresponding to ...