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US Patent Issued to Lam Research on April 14 for "Wafer chuck with thermal tuning cavity features" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,703, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Wafer chuck with thermal tuning cavity features" was inven... Read More


US Patent Issued to DISCO on April 14 for "Wafer transfer method and wafer transfer apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,704, issued on April 14, was assigned to DISCO Corp. (Tokyo). "Wafer transfer method and wafer transfer apparatus" was invented by Kazuki ... Read More


US Patent Issued to DISCO on April 14 for "Wafer transfer method and wafer transfer apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,704, issued on April 14, was assigned to DISCO Corp. (Tokyo). "Wafer transfer method and wafer transfer apparatus" was invented by Kazuki ... Read More


US Patent Issued to MiCo Ceramics on April 14 for "Ceramic susceptor" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,705, issued on April 14, was assigned to MiCo Ceramics Ltd. (Anseong-si, South Korea). "Ceramic susceptor" was invented by Hyung-Jun Cho (... Read More


US Patent Issued to MiCo Ceramics on April 14 for "Ceramic susceptor" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,705, issued on April 14, was assigned to MiCo Ceramics Ltd. (Anseong-si, South Korea). "Ceramic susceptor" was invented by Hyung-Jun Cho (... Read More


US Patent Issued to CANON on April 14 for "Method including positioning a source die or a destination site to compensate for overlay error" (Texas Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,707, issued on April 14, was assigned to CANON K.K. (Tokyo). "Method including positioning a source die or a destination site to compensat... Read More


US Patent Issued to CANON on April 14 for "Method including positioning a source die or a destination site to compensate for overlay error" (Texas Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,707, issued on April 14, was assigned to CANON K.K. (Tokyo). "Method including positioning a source die or a destination site to compensat... Read More


US Patent Issued to Lam Research on April 14 for "Atomic layer etch systems for selectively etching with halogen-based compounds" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,708, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Atomic layer etch systems for selectively etching with hal... Read More


US Patent Issued to Lam Research on April 14 for "Atomic layer etch systems for selectively etching with halogen-based compounds" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,708, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Atomic layer etch systems for selectively etching with hal... Read More


US Patent Issued to Skyworks Solutions on April 14 for "Probe card configured to connect to a probe pad located in saw street of a semiconductor wafer" (Massachusetts, California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,709, issued on April 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Probe card configured to connect to a probe pad locate... Read More