US Patent Issued to Skyworks Solutions on April 14 for "Probe card configured to connect to a probe pad located in saw street of a semiconductor wafer" (Massachusetts, California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,709, issued on April 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Probe card configured to connect to a probe pad located in saw street of a semiconductor wafer" was invented by Guillaume Alexandre Blin (Carlisle, Mass.) and Engin Ibrahim Pehlivanoglu (Costa Mesa, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A probe card for testing or trimming or programming a semiconductor wafer including a first die including a first integrated circuit having a trimmable or programmable component. The probe card including at least one probe arranged to make electrical contact with at least one probe pad arranged on the wafer. The at le...