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US Patent Issued to SK hynix on April 14 for "Stack packages and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,784, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Stack packages and methods of manufacturing the same" wa... Read More


US Patent Issued to SK hynix on April 14 for "Stack packages and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,784, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Stack packages and methods of manufacturing the same" wa... Read More


US Patent Issued to POWERTECH TECHNOLOGY on April 14 for "Package structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,785, issued on April 14, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package structure and manufacturing method t... Read More


US Patent Issued to POWERTECH TECHNOLOGY on April 14 for "Package structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,785, issued on April 14, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package structure and manufacturing method t... Read More


US Patent Issued to Intel on April 14 for "Method of atomic diffusion hybrid bonding and apparatus made from same" (American, Indian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,786, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Method of atomic diffusion hybrid bonding and apparatus made ... Read More


US Patent Issued to Intel on April 14 for "Method of atomic diffusion hybrid bonding and apparatus made from same" (American, Indian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,786, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Method of atomic diffusion hybrid bonding and apparatus made ... Read More


US Patent Issued to SUZHOU INDUSTRIAL PARK FUTES AUTOMOTIVE ELECTRONICS on April 14 for "Symmetric structural type oxygen sensor chip and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,707, issued on April 14, was assigned to SUZHOU INDUSTRIAL PARK FUTES AUTOMOTIVE ELECTRONICS Co. LTD (Suzhou, China). "Symmetric structura... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Biosensor devices and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,708, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Biosensor devices and methods of ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Semiconductor device with sensor and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,709, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device with sensor ... Read More


US Patent Issued to GlobalFoundries U.S. on April 14 for "Ion-sensitive field-effect transistors with local-field bias" (American, Belgian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,710, issued on April 14, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Ion-sensitive field-effect transistors with local-field... Read More