US Patent Issued to POWERTECH TECHNOLOGY on April 14 for "Package structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,785, issued on April 14, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan).

"Package structure and manufacturing method thereof" was invented by Shang-Yu Chang Chien (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a manufacturing method thereof are provided. The package structure includes a redistribution layer, a conductive pillar, an active chip, an encapsulation layer, and another redistribution layer. The conductive pillar and the active chip are side by side disposed on the redistribution layer. The encapsulation layer surrounds the active chip and the conductive pillar, in which ...