US Patent Issued to Intel on April 14 for "Method of atomic diffusion hybrid bonding and apparatus made from same" (American, Indian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,786, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Method of atomic diffusion hybrid bonding and apparatus made from same" was invented by Jay Prakash Gupta (Hillsboro, Ore.), Souvik Ghosh (Kolkata, India), Kimin Jun (Portland, Ore.), Bhupendra Kumar (Beaverton, Ore.), Shashi Vyas (Euclid, Ohio) and Anup Pancholi (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly and a method of forming same. The assembly includes: first and second microelectronic structures; and an interface layer between the two microelectronic structures including dielectric portions in registration with dielectri...