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US Patent Issued to Lam Research on Aug. 11 for "Hybrid frequency plasma source" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,278, issued on Aug. 11, was assigned to Lam Research Corp. (Fremont, Calif.). "Hybrid frequency plasma source" was invented by Yuhou Wang (... Read More


US Patent Issued to SEMES on Aug. 11 for "Apparatus and method for processing substrate using plasma" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,279, issued on Aug. 11, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Apparatus and method for processing substrate usi... Read More


US Patent Issued to Tokyo Electron on Aug. 11 for "Detection device, processing system, and transfer method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,280, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Detection device, processing system, and transfer method" was invente... Read More


US Patent Issued to Micron Technology on Aug. 11 for "Erosion rate monitoring for wafer fabrication equipment" (Singaporean, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,281, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Erosion rate monitoring for wafer fabrication equipment" wa... Read More


US Patent Issued to Tokyo Electron on Aug. 11 for "Substrate support and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,282, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate support and substrate processing apparatus" was invented by... Read More


US Patent Issued to SEMES on Aug. 11 for "Substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,283, issued on Aug. 11, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Substrate processing apparatus" was invented by Young Hw... Read More


US Patent Issued to Resonac on Aug. 11 for "Adhesion removal method and film-forming method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,284, issued on Aug. 11, was assigned to Resonac Corp. (Tokyo). "Adhesion removal method and film-forming method" was invented by Yosuke Tan... Read More


US Patent Issued to IBSS Group on Aug. 11 for "System and method for adaptive cleaning of a high-vacuum chamber" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,285, issued on Aug. 11, was assigned to IBSS Group (San Francisco). "System and method for adaptive cleaning of a high-vacuum chamber" was ... Read More


US Patent Issued to HITACHI HIGH-TECH on Aug. 11 for "Plasma processing method and plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,286, issued on Aug. 11, was assigned to HITACHI HIGH-TECH Corp. (Tokyo). "Plasma processing method and plasma processing apparatus" was inv... Read More


US Patent Issued to Tokyo Electron on Aug. 11 for "Plasma etching with metal sputtering" (New York Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,287, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma etching with metal sputtering" was invented by Minjoon Park (A... Read More