ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,279, issued on Aug. 11, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea).
"Apparatus and method for processing substrate using plasma" was invented by Young Je Um (Busan, South Korea), Wan Jae Park (Gyeonggi-do, South Korea), Joun Taek Koo (Seoul, South Korea), Dong Hun Kim (Seoul, South Korea), Seong Gil Lee (Gyeonggi-do, South Korea), Ji Hwan Lee (Incheon, South Korea), Dong Sub Oh (Busan, South Korea), Myoung Sub Noh (Gyeonggi-do, South Korea) and Du Ri Kim (Incheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a substrate processing apparatus and method capable of improving line edge roughness (LER). The...