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US Patent Issued to ROHM on Aug. 25 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,209, issued on Aug. 25, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Yuki Nakano (Kyoto, Japan). A... और पढ़ें


US Patent Issued to UNITED MICROELECTRONICS on Aug. 25 for "Semiconductor structure and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,210, issued on Aug. 25, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and fabrication met... और पढ़ें


US Patent Issued to MITSUI KINZOKU on Aug. 25 for "Method for producing wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,211, issued on Aug. 25, was assigned to MITSUI KINZOKU COMPANY Ltd. (Tokyo). "Method for producing wiring board" was invented by Yukiko Kit... और पढ़ें


US Patent Issued to Rohm on Aug. 25 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,212, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Tsunehisa Ono (Kyoto, Japan). ... और पढ़ें


US Patent Issued to STATS ChipPAC on Aug. 25 for "Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstituted wafer" (Singaporean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,213, issued on Aug. 25, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming channels in encaps... और पढ़ें


US Patent Issued to DENSO on Aug. 25 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,214, issued on Aug. 25, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device and method of manufacturing the same" was i... और पढ़ें


US Patent Issued to NICHIA on Aug. 25 for "Image display device and method for manufacturing image display device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,216, issued on Aug. 25, was assigned to NICHIA Corp. (Anan, Japan). "Image display device and method for manufacturing image display device... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,217, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufact... और पढ़ें


US Patent Issued to Google on Aug. 25 for "Optical communication for memory disaggregation in high performance computing" (California, Vermont Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,218, issued on Aug. 25, was assigned to Google LLC (Mountain View, Calif.). "Optical communication for memory disaggregation in high perfor... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,219, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit package and meth... और पढ़ें