Exclusive

Publication

Byline

Location

US Patent Issued to Skyworks Solutions on Aug. 25 for "Methods related to dual-sided radio-frequency package with overmold structure" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,179, issued on Aug. 25, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Methods related to dual-sided radio-frequency package wi... Read More


US Patent Issued to Intel on Aug. 25 for "Techniques for protecting integrated circuitry from plasma-induced electrostatic discharge using a carrier substrate with junction features" (Oregon Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,180, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Techniques for protecting integrated circuitry from plasma-indu... Read More


US Patent Issued to PSEMI on Aug. 25 for "Transient stabilized SOI FETs" (California, Colorado, Illinois Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,181, issued on Aug. 25, was assigned to PSEMI Corp. (San Diego). "Transient stabilized SOI FETs" was invented by Robert Mark Englekirk (Lit... Read More


US Patent Issued to TEXAS INSTRUMENTS on Aug. 25 for "Microelectronic device package including inductor and semiconductor device" (Texas Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,182, issued on Aug. 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Microelectronic device package including inductor and semiconduct... Read More


US Patent Issued to TEXAS INSTRUMENTS on Aug. 25 for "Integrated circuit" (Japanese, American Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,183, issued on Aug. 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit" was invented by Yuki Sato (Saitama, Japan), K... Read More


US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on Aug. 25 for "Method for aligning backside pattern based on one or more frontside alignment marks of a semiconductor wafer" (Oregon, Washington, California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,184, issued on Aug. 25, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto). "Method for aligning backside pattern bas... Read More


US Patent Issued to STATS ChipPAC on Aug. 25 for "Semiconductor device and method of making face-up wafer-level package using intensive pulsed light irradiation" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,185, issued on Aug. 25, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of making face-up wafer-level... Read More


US Patent Issued to Infineon Technologies Austria on Aug. 25 for "Semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor" (German, Austrian Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,186, issued on Aug. 25, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor package or a printed circuit bo... Read More


US Patent Issued to Rohm on Aug. 25 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,187, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Kenji Fujii (Kyoto, Japan), Ta... Read More


US Patent Issued to FUJI ELECTRIC on Aug. 25 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,188, issued on Aug. 25, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Shinji Tada (Matsu... Read More