US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on Aug. 25 for "Method for aligning backside pattern based on one or more frontside alignment marks of a semiconductor wafer" (Oregon, Washington, California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,184, issued on Aug. 25, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto).

"Method for aligning backside pattern based on one or more frontside alignment marks of a semiconductor wafer" was invented by Jian Wang (Portland, Ore.), Lei Zhang (Portland, Ore.), Changqing Zhan (Vancouver, Wash.) and Tai-Ming Lin (Alhambra, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method comprises the steps of providing a semiconductor wafer comprising a substrate layer; forming a first alignment mark and a second alignment mark; forming a plurality of super junction buffer regions; forming additional two or more epitaxial layers; for...