US Patent Issued to Skyworks Solutions on Aug. 25 for "Methods related to dual-sided radio-frequency package with overmold structure" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,179, issued on Aug. 25, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Methods related to dual-sided radio-frequency package with overmold structure" was invented by Howard E. Chen (Anaheim, Calif.) and Robert Francis Darveaux (Corona Del Mar, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for implementing a packaged radio-frequency device is disclosed, including providing a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The method includes implementing a package on the first side of the packaging substrate, the package including a first ...