US Patent Issued to STATS ChipPAC on Aug. 25 for "Semiconductor device and method of making face-up wafer-level package using intensive pulsed light irradiation" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,185, issued on Aug. 25, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of making face-up wafer-level package using intensive pulsed light irradiation" was invented by YongMoo Shin (Jung-gu, South Korea), HeeSoo Lee (Incheon, South Korea) and SeungHyun Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a carrier. An electrical component is disposed over the carrier. An encapsulant is deposited over the electrical component. A conductive layer is formed over the encapsulant. The conductive layer is deposited as a plurality of graphene-coated metal balls in a matrix...