ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,934, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Pulsed voltage waveform with binary pulses for biasing... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,935, issued on Oct. 6, was assigned to Lam Research Corp. (Fremont, Calif.). "Process control for ion energy delivery using multiple generat... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,936, issued on Oct. 6, was assigned to Inspiring Atoms Pte Ltd (Singapore). "System and method for delivering pulsed RF power from a single ... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,937, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus" was invented by Nozomu Nagashima (Miyagi, ... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,938, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Filter circuit and plasma processing apparatus" was invented by Taro Ik... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,939, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus" was invented by Masaki Hirayama (Fuchu Cit... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,940, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus" was invented by Mitsutoshi Ashida (Yamanas... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,941, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Modification method and modification device" was invented by Takafumi N... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,942, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and New Power Plasma Co. LTD. (Pyeongtaek-si, Sou... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,943, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "External cooling assembly for substrate support" was i... और पढ़ें