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US Patent Issued to Samsung Electro-Mechanics on Nov. 3 for "Circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,157, issued on Nov. 3, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea). "Circuit board" was invented by Ho-Jae Le... Read More


US Patent Issued to MEC ADDHEAT (KAIPING) on Nov. 3 for "Anti-break structure for setting buffer sheets at circuit board edges" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,158, issued on Nov. 3, was assigned to MEC ADDHEAT (KAIPING) Co. LTD. (Kaiping City, China). "Anti-break structure for setting buffer sheets... Read More


US Patent Issued to NGK ELECTRONICS DEVICES, NGK INSULATORS on Nov. 3 for "Ceramic wiring member" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,159, issued on Nov. 3, was assigned to NGK ELECTRONICS DEVICES INC. (Mine, Japan) and NGK INSULATORS Ltd. (Nagoya, Japan). "Ceramic wiring m... Read More


US Patent Issued to JOHNAN on Nov. 3 for "Circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,160, issued on Nov. 3, was assigned to JOHNAN Corp. (Uji, Japan). "Circuit board" was invented by Yoshinari Matsuda (Uji, Japan), Kazuhiro K... Read More


US Patent Issued to CelLink on Nov. 3 for "Flexible interconnect circuits and methods of fabrication thereof" (Michigan, California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,161, issued on Nov. 3, was assigned to CelLink Corp. (San Carlos, Calif.). "Flexible interconnect circuits and methods of fabrication thereo... Read More


US Patent Issued to CANON on Nov. 3 for "Circuit board and image forming apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,162, issued on Nov. 3, was assigned to CANON K.K. (Tokyo). "Circuit board and image forming apparatus" was invented by Takeshi Honda (Chiba,... Read More


US Patent Issued to NITTO DENKO on Nov. 3 for "Wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,163, issued on Nov. 3, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board" was invented by Shusaku Shibata (Osaka, Japa... Read More


US Patent Issued to Advanced ACEBIOTEK on Nov. 3 for "Printed circuit board structure and printed circuit board detection method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,164, issued on Nov. 3, was assigned to Advanced ACEBIOTEK Co. LTD. (Hsinchu County, Taiwan). "Printed circuit board structure and printed ci... Read More


US Patent Issued to GUANGZHOU FANGBANG ELECTRONICS on Nov. 3 for "Metal foil, circuit board, and method for manufacturing circuit board" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,165, issued on Nov. 3, was assigned to GUANGZHOU FANGBANG ELECTRONICS Co. LTD (Guangzhou, China). "Metal foil, circuit board, and method for... Read More


US Patent Issued to AMS-OSRAM INTERNATIONAL on Nov. 3 for "Optoelectronic assembly and method for the production of same" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,166, issued on Nov. 3, was assigned to AMS-OSRAM INTERNATIONAL GMBH (Regensburg, Germany). "Optoelectronic assembly and method for the produ... Read More