US Patent Issued to CelLink on Nov. 3 for "Flexible interconnect circuits and methods of fabrication thereof" (Michigan, California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,161, issued on Nov. 3, was assigned to CelLink Corp. (San Carlos, Calif.).

"Flexible interconnect circuits and methods of fabrication thereof" was invented by Jean-Paul Ortiz (White Lake, Mich.), Malcolm Parker Brown (Mountain View, Calif.), Mark Terlaak (San Carlos, Calif.), Will Findlay (San Carlos, Calif.), Kevin Michael Coakley (Belmont, Calif.) and Casey Anderson (San Carlos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During...