US Patent Issued to MEC ADDHEAT (KAIPING) on Nov. 3 for "Anti-break structure for setting buffer sheets at circuit board edges" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,158, issued on Nov. 3, was assigned to MEC ADDHEAT (KAIPING) Co. LTD. (Kaiping City, China).

"Anti-break structure for setting buffer sheets at circuit board edges" was invented by Chienchou Chen (Kaiping City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses an anti-break structure for setting buffer sheets at circuit board edges; the setting of polyimide (PI) or polyester films with a thickness less than 0.1 mm at PCB, copper foil circuit board or FPC board edges can help to achieve an effective isolation between electronic wires and circuit board edge corners. This structure can not only achieve protection under...