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US Patent Issued to Sumitomo Electric Device Innovations on Sept. 22 for "Semiconductor device and wafer" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,649, issued on Sept. 22, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan). "Semiconductor device and wafer" was... और पढ़ें


US Patent Issued to AaltoSemi on Sept. 22 for "Package substrate and fabricating method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,650, issued on Sept. 22, was assigned to AaltoSemi Inc. (Nanjing City, China). "Package substrate and fabricating method thereof" was inve... और पढ़ें


US Patent Issued to PHOENIX PIONEER TECHNOLOGY on Sept. 22 for "Semiconductor package carrier board structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,651, issued on Sept. 22, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan). "Semiconductor package carrier boar... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package and method of manufacturing" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,652, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufa... और पढ़ें


US Patent Issued to SHINDENGEN ELECTRIC MANUFACTURING on Sept. 22 for "Semiconductor device package with flat plate and pin terminals" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,653, issued on Sept. 22, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor device package with flat plate... और पढ़ें


US Patent Issued to MITSUBISHI ELECTRIC on Sept. 22 for "Semiconductor device and power converter" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,654, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor device and power converter" was invented by Hod... और पढ़ें


US Patent Issued to Rohm on Sept. 22 for "Semiconductor device provided with insulating element bonded to insulating substrate" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,655, issued on Sept. 22, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device provided with insulating element bonded to in... और पढ़ें


US Patent Issued on Sept. 22 for "Power module" (Arkansas, North Carolina Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,656, issued on Sept. 22. "Power module" was invented by Brice McPherson (Fayetteville, Ark.), Brandon Passmore (Fayetteville, Ark.), Rober... और पढ़ें


US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on Sept. 22 for "Integration structure for connecting a plurality of semiconductor devices, associated methods, assembly and system" (French Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,657, issued on Sept. 22, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Integration structure fo... और पढ़ें


US Patent Issued to Eliyan on Sept. 22 for "Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs)" (California Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,658, issued on Sept. 22, was assigned to Eliyan Corp. (Santa Clara, Calif.). "Method and apparatus to reduce complexity and cost for multi... और पढ़ें