US Patent Issued to SHINDENGEN ELECTRIC MANUFACTURING on Sept. 22 for "Semiconductor device package with flat plate and pin terminals" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,653, issued on Sept. 22, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo).

"Semiconductor device package with flat plate and pin terminals" was invented by Soichiro Umeda (Saitama, Japan) and Atsushi Kyutoku (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: an insulating substrate; a first conductor portion and a second conductor portion that are formed on the insulating substrate; a semiconductor element disposed on the first conductor portion; a first terminal that is connected to a first electrode of the semiconductor element; a second terminal that is connected to the first conduct...