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US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor device comprising non-oxidizing material" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,618, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device comprising non-oxidiz... और पढ़ें


US Patent Issued to SK hynix on Sept. 22 for "Semiconductor device and method of manufacturing semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,619, issued on Sept. 22, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device and method of manufacturing semicon... और पढ़ें


US Patent Issued to Sandisk Technologies on Sept. 22 for "Three-dimensional memory device including capped molybdenum word lines and method of making the same" (California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,620, issued on Sept. 22, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device including capped m... और पढ़ें


US Patent Issued to Intel on Sept. 22 for "Inline circuit edit for backside power delivery with deep via" (Oregon, California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,621, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Inline circuit edit for backside power delivery with deep via... और पढ़ें


US Patent Issued to Altera on Sept. 22 for "Die-to-die power delivery" (American, Malaysian, Indian Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,622, issued on Sept. 22, was assigned to Altera Corp. (San Jose, Calif.). "Die-to-die power delivery" was invented by Ankireddy Nalamalpu ... और पढ़ें


US Patent Issued to Kioxia on Sept. 22 for "Semiconductor memory device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,624, issued on Sept. 22, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device" was invented by Takafumi Masuda (Kawasaki, Ja... और पढ़ें


US Patent Issued to SK hynix on Sept. 22 for "Semiconductor device and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,625, issued on Sept. 22, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and method for fabricating the sa... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Sept. 22 for "Semiconductor device having fuse component" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,626, issued on Sept. 22, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device having fuse component" wa... और पढ़ें


US Patent Issued to IMEC VZW on Sept. 22 for "Semiconductor component with metal-insulator-metal capacitor assembly" (Belgian Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,627, issued on Sept. 22, was assigned to IMEC VZW (Leuven, Belgium). "Semiconductor component with metal-insulator-metal capacitor assembl... और पढ़ें


COLLABORATIVE COMBAT AIRCRAFT ARRIVE AT CREECH AFB, ADVANCING OPERATIONAL INTEGRATION

WRIGHT-PATTERSON AIR FORCE BASE, Ohio, Sept. 24 -- The U.S. Air Force Institute of Technology issued the following news release: The Air Force received its first two Collaborative Combat Aircraft at ... और पढ़ें