ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,622, issued on Sept. 22, was assigned to Altera Corp. (San Jose, Calif.).
"Die-to-die power delivery" was invented by Ankireddy Nalamalpu (Portland, Ore.), Mahesh K. Kumashikar (Bangalore, India), Atul Maheshwari (Portland, Ore.) and Lai Guan Tang (Tanjung Bungah, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die includes one or more power delivery layers to deliver power within the die. Additionally, the die also includes one or more transistor layers to at least partially implement a programmable fabric for the die. Furthermore, the die further includes one or more signal routing layers to transmit signals for use by the programmable ...