ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,593, issued on Sept. 22, was assigned to Tower Semiconductor Ltd. (Migdal Haemek, Israel). "Detection of a position of a wafer within a tr... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,594, issued on Sept. 22, was assigned to Massachusetts Institute of Technology (Cambridge, Mass.). "Reticle exchange device with reticle l... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,595, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Method of measuring positional deviation of substrate stage and sub... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,596, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Retaining ring for chemical-m... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,597, issued on Sept. 22, was assigned to MIRAIAL Co. LTD. (Tokyo). "Substrate storing container and lid-body-side substrate support part" ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,598, issued on Sept. 22, was assigned to Taiwan Seimconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Wafer storage device with partic... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,599, issued on Sept. 22, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Transport facility" was invented by Kengo Ikedo (Komaki, Japan)... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,600, issued on Sept. 22, was assigned to EV Group E. Thallner GmbH (St. Florian am Inn, Austria). "Method and device for the alignment of ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,601, issued on Sept. 22, was assigned to Micron Technology Inc. (Boise, Idaho). "Mount tape having an inner support layer between adhesive... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,602, issued on Sept. 22, was assigned to TEL Manufacturing and Engineering of America Inc. (Chaska, Minn.). "Multi-wafer handling system" ... Read More