US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 22 for "Retaining ring for chemical-mechanical polishing" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,596, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Retaining ring for chemical-mechanical polishing" was invented by Jeng-Chi Lin (Hsinchu, Taiwan), Chi-hsiang Shen (Tainan, Taiwan), Te-Chien Hou (Kaohsiung, Taiwan), Tang-Kuei Chang (Tainan, Taiwan), Chi-Jen Liu (Taipei, Taiwan), Hui-Chi Huang (Hsinchu, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a chemical-mechanical polishing apparatus, a retaining ring for a chemical-mechanical polishing apparatus, and a chemical-mechanical polishing method. A chemical-mechanical polishing apparatus ...