US Patent Issued to Micron Technology on Sept. 22 for "Mount tape having an inner support layer between adhesive layers for semiconductor device assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,601, issued on Sept. 22, was assigned to Micron Technology Inc. (Boise, Idaho).

"Mount tape having an inner support layer between adhesive layers for semiconductor device assembly" was invented by Brandon P. Wirz (Taichung City, Taiwan), Sui Chi Huang (Taichung City, Taiwan) and Youngrae Kim (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations described herein relate to a mount tape and methods of using the mount tape for semiconductor device manufacturing. The mount tape may include a first adhesive layer configured for release at a first stage of a semiconductor device manufacturing process, a second adhesive laye...