ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,663, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Singulation of integrated circuit package substrates with gla... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,664, issued on Sept. 22, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Wire bonding arrays, maintenance stati... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,665, issued on Sept. 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Substrate and method of manufacturin... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,666, issued on Sept. 22, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Package structures, fabricating methods the... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,667, issued on Sept. 22, was assigned to TDK Corp. (Tokyo). "Electronic circuit package, its manufacturing method, and electronic device h... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,668, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Dam surrounding a die on a substrate" was invented by Liang H... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,669, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Protective coating on an edge of a glass core" was invented b... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,670, issued on Sept. 22, was assigned to ELTA SYSTEMS LTD. (Lod, Israel). "Encapsulation techniques" was invented by Itzhak Shapir (Haifa,... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,671, issued on Sept. 22, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device having first and second organi... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,672, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure with inte... और पढ़ें