US Patent Issued to ELTA SYSTEMS on Sept. 22 for "Encapsulation techniques" (Israeli Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,670, issued on Sept. 22, was assigned to ELTA SYSTEMS LTD. (Lod, Israel).

"Encapsulation techniques" was invented by Itzhak Shapir (Haifa, Israel) and Michael Kedem (Ashdod, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) assembly and a method for encapsulating of IC are presented. The IC assembly comprises an IC substrate having one or more micro-devices, at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal sa...