US Patent Issued to TDK on Sept. 22 for "Electronic circuit package, its manufacturing method, and electronic device having electronic circuit package" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,667, issued on Sept. 22, was assigned to TDK Corp. (Tokyo).

"Electronic circuit package, its manufacturing method, and electronic device having electronic circuit package" was invented by Shuichi Takizawa (Tokyo), Hiromu Harada (Tokyo), Atsushi Yoshino (Tokyo) and Yuki Okino (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic circuit package disclosed in the present disclosure includes: a package board having an upper surface, a bottom surface positioned on a side opposite to the upper surface, and a side surface connecting the upper and bottom surfaces; an electronic component mounted on the upper surface of the package board; a fi...