US Patent Issued to Yangtze Memory Technologies on Sept. 22 for "Package structures, fabricating methods thereof, and memory systems" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,666, issued on Sept. 22, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China).

"Package structures, fabricating methods thereof, and memory systems" was invented by Qi Xu (Wuhan, China), Chao Wang (Wuhan, China), Zhiyong Suo (Wuhan, China), XuHui Wang (Wuhan, China) and Zhen Xu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of the present disclosure disclose a package structure, a fabricating method thereof, and a memory system. The package structure includes: a packaging substrate having a first surface and a second surface opposite the first surface; a semiconductor device on the first surface of the p...