ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,653, issued on Sept. 22, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor device package with flat plate... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,654, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor device and power converter" was invented by Hod... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,655, issued on Sept. 22, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device provided with insulating element bonded to in... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,656, issued on Sept. 22. "Power module" was invented by Brice McPherson (Fayetteville, Ark.), Brandon Passmore (Fayetteville, Ark.), Rober... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,657, issued on Sept. 22, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Integration structure fo... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,658, issued on Sept. 22, was assigned to Eliyan Corp. (Santa Clara, Calif.). "Method and apparatus to reduce complexity and cost for multi... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,659, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including semiconduc... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,660, issued on Sept. 22, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Jap... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,661, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.). "Scalable extreme large size substrate integration" was invented ... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,662, issued on Sept. 22, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Molded thin semiconductor die packa... और पढ़ें