US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 22 for "Molded thin semiconductor die packages and related methods" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,662, issued on Sept. 22, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Molded thin semiconductor die packages and related methods" was invented by Shinzo Ishibe (Oizumi-machi, Japan) and Takashi Noma (Ota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a method of forming an over pad metallization structure may include providing a semiconductor substrate including a plurality of copper pads on a first side of the semiconductor substrate; electroless plating an over pad metallization including nickel, palladium, and gold onto each copper pad of the plurality of copper pads; and patterning a la...