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US Patent Issued to ENTEGRIS on Aug. 4 for "Reticle pod having coated sensor zones" (Minnesota Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,958, issued on Aug. 4, was assigned to ENTEGRIS INC. (Billerica, Mass.). "Reticle pod having coated sensor zones" was invented by Russ V. Ra... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Wafer storage and transport system and method of operation of wafer storage and transport system" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,959, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wafer storage and transport system and method ... Read More


US Patent Issued to Applied Materials on Aug. 4 for "Bipolar ESC to prevent substrate backside discharging" (California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,960, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Bipolar ESC to prevent substrate backside discharging"... Read More


US Patent Issued to Tokyo Institute of Technology on Aug. 4 for "Electrostatic attraction device and electrostatic adsorption method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,961, issued on Aug. 4, was assigned to Tokyo Institute of Technology (Tokyo). "Electrostatic attraction device and electrostatic adsorption ... Read More


US Patent Issued to Sumitomo Osaka Cement on Aug. 4 for "Electrostatic chuck device with an improved electrostatic chuck plate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,962, issued on Aug. 4, was assigned to Sumitomo Osaka Cement Co. Ltd. (Tokyo). "Electrostatic chuck device with an improved electrostatic ch... Read More


US Patent Issued to DISCO on Aug. 4 for "Expanding machine and expanding method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,963, issued on Aug. 4, was assigned to DISCO Corp. (Tokyo). "Expanding machine and expanding method" was invented by Kaoru Amano (Tokyo) and... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Methods and systems for dry etching" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,964, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Methods and systems for dry etchi... Read More


US Patent Issued to LAM RESEARCH on Aug. 4 for "Apparatus for processing a wafer-shaped article" (Austrian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,965, issued on Aug. 4, was assigned to LAM RESEARCH AG (Villach, Austria). "Apparatus for processing a wafer-shaped article" was invented by... Read More


US Patent Issued to BEIJING NAURA MICROELECTRONICS EQUIPMENT on Aug. 4 for "Semiconductor process device and wafer support structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,966, issued on Aug. 4, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing). "Semiconductor process device and wafer ... Read More


US Patent Issued to Applied Materials Israel on Aug. 4 for "Substrate handling system background" (Israeli Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,967, issued on Aug. 4, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel). "Substrate handling system background" was invented ... Read More