US Patent Issued to LAM RESEARCH on Aug. 4 for "Apparatus for processing a wafer-shaped article" (Austrian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,965, issued on Aug. 4, was assigned to LAM RESEARCH AG (Villach, Austria).

"Apparatus for processing a wafer-shaped article" was invented by Burkhart Schier (Klagenfurt, Austria), Michael Brugger (Millstatt, Austria), Wolfgang Krautzer (Thoerl-Maglern, Austria) and Thomas Passegger (Villach, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus for processing a wafer-shaped article, the apparatus comprising a support configured to support the wafer-shaped article during a processing operation to be performed on the wafer-shaped article; wherein: the support comprises a support body and a plurality of gripping pin assemblies adapted and pos...