US Patent Issued to BEIJING NAURA MICROELECTRONICS EQUIPMENT on Aug. 4 for "Semiconductor process device and wafer support structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,966, issued on Aug. 4, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing).

"Semiconductor process device and wafer support structure thereof" was invented by Shoulin Huang (Beijing), Jun Zhang (Beijing), Jingfeng Wei (Beijing) and Qing She (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer support structure disposed in a loading chamber of a semiconductor process device to support a wafer and drive the wafer to ascend or descend includes: a lifting component, a supporting component, a compressing component, and an adjusting component. The lifting component includes a lifting shaft. A mounting section is provided ...