ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,684, issued on April 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method and system for mitigating underlayer damage du... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,685, issued on April 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods for controlling spin-on self-assembled monolayer (SAM) sele... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,685, issued on April 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods for controlling spin-on self-assembled monolayer (SAM) sele... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,686, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip and semiconductor packa... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,686, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip and semiconductor packa... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,687, issued on April 14, was assigned to Destination 2D Inc. (San Jose, Calif.). "Large-area/wafer-scale CMOS-compatible 2D-material inter... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,687, issued on April 14, was assigned to Destination 2D Inc. (San Jose, Calif.). "Large-area/wafer-scale CMOS-compatible 2D-material inter... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,688, issued on April 14, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo). "Method for manufacturing SOI wafer" was invented by Hiroji ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,688, issued on April 14, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo). "Method for manufacturing SOI wafer" was invented by Hiroji ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,689, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Bracing structure, semiconductor device with t... Read More