US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor chip and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,686, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip and semiconductor package including the same" was invented by Yongho Kim (Suwon-si, South Korea) and Jeonghoon Ahn (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip and a semiconductor package, the semiconductor chip includes a semiconductor substrate; a through electrode penetrating the semiconductor substrate; a bonding pad including a first conductive pad connected to the through electrode, and a second conductive pad on a central portion of the first conductive pad, an outer portion of the f...