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US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Three dimensional heterogeneous integration with double-sided semiconductor dies and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,496, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Three dimensional heterogeneous int... और पढ़ें


US Patent Issued to FUJI ELECTRIC on July 21 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,497, issued on July 21, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module" was invented by Hiroyuki Nogawa (M... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,498, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Chaje... और पढ़ें


US Patent Issued to Daktronics on July 21 for "Controlling adhesive reflow for transfer printing" (North Carolina, New York Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,499, issued on July 21, was assigned to Daktronics Inc. (Brookings, S.D.). "Controlling adhesive reflow for transfer printing" was invented... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Semiconductor device with spacer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,500, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with spacer and method for ... और पढ़ें


US Patent Issued to Adeia Semiconductor Bonding Technologies on July 21 for "Electrical redundancy for bonded structures" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,501, issued on July 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Electrical redundancy for bonded... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,502, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufact... और पढ़ें


US Patent Issued to Renesas Electronics on July 21 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,503, issued on July 21, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was ... और पढ़ें


US Patent Issued to MAGNA ELECTRONICS on July 21 for "Multi-camera vehicular vision system" (German Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,833, issued on July 21, was assigned to MAGNA ELECTRONICS INC. (Auburn Hills, Mich.). "Multi-camera vehicular vision system" was invented b... और पढ़ें


US Patent Issued to MBDA UK on July 21 for "Apparatus and method for imaging" (British Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,834, issued on July 21, was assigned to MBDA UK Ltd. (Stevenage, Great Britain). "Apparatus and method for imaging" was invented by Antony ... और पढ़ें